الرئيسية
via in late April promised that "ultra-mobility" would be the focus of its eighth-annual Via Technology Forum, this year co-located in Taipei with the Computex trade show. The company's recent announcements related to mobile computing include the launch of the Pico-ITX form-factor, as well as the launch of several high-integration processors and chipsets designed to reduce board area and cooling requirements in small battery-powered devices
The mobile-ITX board that Chen demonstrated this morning appears to be based on a 1GHz "C7-S" processor -- apparently a standard Via C7-M shoe-horned into a 9 x 11mm package. The chip had not previously been announced. The mobile-ITX board also apparently uses an "S" (small) version of the CX700 integrated north-/south-bridge chipset. And, it appears to have an on-board DC-DC converter. Additionally, according to Via, the board includes a CDMA baseband processor chip, suggesting that the mobile-ITX board could be used as the basis for x86-compatible
smartphones
The mobile-ITX board that Chen demonstrated this morning appears to be based on a 1GHz "C7-S" processor -- apparently a standard Via C7-M shoe-horned into a 9 x 11mm package. The chip had not previously been announced. The mobile-ITX board also apparently uses an "S" (small) version of the CX700 integrated north-/south-bridge chipset. And, it appears to have an on-board DC-DC converter. Additionally, according to Via, the board includes a CDMA baseband processor chip, suggesting that the mobile-ITX board could be used as the basis for x86-compatible
smartphones
